Tech Shorts: A Compilation of the Latest SoCs, Development Boards, and More
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In this edition of Tech Shorts, we highlight six segments of industry news focusing on power, connectivity, AI, and more.
Our mission at BonChip Electronics is to keep you informed about pivotal developments in electronics and semiconductor technology. With this goal, we're introducing a new article format, Tech Shorts, to compile news that might otherwise be overlooked during a busy week.
Here's an overview of several recently announced products catering to applications from smart homes to data centers.
1. Qorvo Unveils Matter SoC
Qorvo has recently introduced its latest IoT solution, the QPG6200L SoC, designed for smart home devices. Featuring the company's proprietary ConcurrentConnect technology, this SoC supports multiple protocols, including Matter, Zigbee, and Bluetooth Low Energy.
Block diagram of the QPG6200L. Image used courtesy of Qorvo
The QPG6200L is noted for its energy efficiency, with a sleep current of less than 1 µA, making it 30% more power-efficient than competing solutions. Optimized for battery-operated and energy-harvesting devices, Qorvo has tailored the QPG6200L for IoT applications such as sensors, lighting, and home hubs. The SoC also integrates a built-in secure element and achieves PSA Level 2 certification to provide robust protection against common IoT software vulnerabilities.
The QPG6200L is currently available for sampling, with full-scale production expected to commence next year.
Key Features:
- Matter Compatibility: Enables seamless integration with Matter-enabled ecosystems.
- Energy Efficiency: Low sleep current (less than 1 µA) for extended battery life.
- Security: Built-in secure element and PSA Level 2 certification for enhanced security.
- Applications: Ideal for sensors, lighting, and home hubs.
BonChip Electronics is a proud distributor of Qorvo products, offering the QPG6200L SoC and other innovative solutions for your IoT projects.
2. Nuvoton Launches AI Development Board
Nuvoton has recently released its NuEzAI-M55M1 development board to streamline endpoint AI development by eliminating the need for extensive programming skills. Powered by the NuMicro M55M1 microcontroller, this development board is based on the Arm Cortex-M55 core, clocked at 220 MHz, and includes an Arm Ethos-U55 NPU. This setup allows the board to efficiently handle both machine learning inference and CNN/RNN operations. The microcontroller is equipped with 1.5 MB of SRAM and 2 MB of Flash memory, which can be expanded using HYPERBUS interfaces to support HYPERRAM or HYPERFLASH.
The NuEzAI-M55M1 offers digital signal processing and on-device machine-learning inference capabilities. Image used courtesy of Nuvoton
Nuvoton highlights the M55M1’s capability to operate at a low voltage
range of 1.8 V to 3.6 V while maintaining functionality across extreme
temperature conditions, from -40°C to +105°C. The M55M1 integrates
several features to optimize power consumption and security. For
instance, during low-power sleep mode, the CPU allows various sensors,
such as microphones and image sensors, to continue functioning and
monitor predefined events. Furthermore, the NPU enables secure, on-chip
storage of machine-learning model data, reducing the risk of tampering
or data theft.
Key Features:
- Powerful Performance: Arm Cortex-M55 core clocked at 220 MHz and Arm Ethos-U55 NPU for accelerated AI tasks.
- Low Power Consumption: Optimized for battery-powered applications with a wide operating voltage range and low-power sleep modes.
- Security Features: Secure on-chip storage for machine-learning model data to protect against tampering.
BonChip Electronics offers the Nuvoton NuEzAI-M55M1 development board, along with a wide range of other development tools and components for your AI projects.
3. Microchip Introduces Voltage-Controlled SAW Oscillators
Microchip has recently launched a new family of voltage-controlled SAW oscillators (VCSOs), the 101765 series. This new family targets radar and test instrumentation systems that demand ultra-low phase noise and high-frequency stability. Available in 320 MHz and 400 MHz configurations, these VCSOs offer phase noise performance of 166 dBc/Hz at 10 kHz offset, providing exceptional signal clarity in mission-critical applications like radar systems and active electronically scanned array (AESA) systems.
Functional block diagram of Microchip’s new VCSOs, the 101765. Image used courtesy of Microchip
Packaged in a small 1-inch × 1-inch hermetic Kovar enclosure, the VCSOs are optimized for aerospace and defense applications, where size, weight, power, and cost (SWaP-C) are critical design considerations. The devices operate at supply voltages ranging from 4.75 V to 15.75 V, with a current draw of 111 mA. Meanwhile, the ultra-low phase noise characteristics of these devices enable improved lower-limit detection, enhancing radar accuracy and overall system performance.
Key Features:
- Ultra-Low Phase Noise: 166 dBc/Hz at 10 kHz offset for precise signal generation.
- Compact Design: Small 1-inch × 1-inch hermetic Kovar enclosure for space-constrained applications.
- Wide Operating Voltage: Operates from 4.75 V to 15.75 V.
- Applications: Radar systems, active electronically scanned array (AESA) systems, and other test instrumentation.
BonChip Electronics is a distributor of Microchip products, including the 101765 series VCSOs.
4. Toshiba Expands 1200-V SiC Schottky Barrier Diodes
Toshiba has recently expanded its lineup of third-generation silicon carbide (SiC) Schottky barrier diodes (SBD) with the TRSxxx120Hx series. Toshiba designed these 1,200-V-rated devices to improve the efficiency of industrial power systems. The new diodes use Toshiba’s advanced junction barrier Schottky (JBS) structure, which combines a merged PiN Schottky (MPS) design to lower forward voltage at high currents while simultaneously reducing leakage current. This structure equips the diodes for high-power applications such as photovoltaic inverters, electric vehicle (EV) charging stations, and uninterruptible power supplies (UPS).
Toshiba’s new SiC SBD devices have a high IF-VF curve because of their JBS structure. Image used courtesy of Toshiba
Toshiba claims that the TRSxxx120Hx series offers an industry-leading forward voltage of 1.27 V and a low total capacitive charge of 109 nC, resulting in minimal power loss during switching events. Additionally, the devices feature a low reverse current of 2.0 μA, reducing overall system losses.
Key Features:
- High Efficiency: Industry-leading forward voltage of 1.27 V and low total capacitive charge.
- High Power Applications: Suitable for photovoltaic inverters, EV charging stations, and UPS systems.
- Rugged Design: Built to withstand harsh operating conditions.
BonChip Electronics offers Toshiba's SiC Schottky barrier diodes, along with a wide range of other power components.
5. Littelfuse Unveils Ultra-High Amperage SMD Fuse Series
Littelfuse has recently introduced the 871 series of high-current, surface-mount device (SMD) fuses—the first of its kind to handle 150 A and 200 A in a compact form factor. This new series provides a space-saving alternative to traditional through-hole fuses to meet the growing power requirements in modern electronics and reduce the need for parallel fusing. By simplifying the design process, the 871 series allows engineers to optimize their designs for smaller, more efficient PCB layouts, effectively lowering the bill of materials and simplifying the overall build.
Littelfuses’ 871 series. Image used courtesy of Littelfuse
Littelfuse asserts that the 871 series is particularly well-suited for high-power applications in sectors such as data centers, communications infrastructure, and server racks, where reliable protection against overcurrent is necessary to maintain uptime and operational efficiency.
Key Features:
- High Current Ratings: Handle currents up to 200 A, simplifying designs and reducing the need for parallel fusing.
- Compact Design: Save valuable PCB space compared to traditional through-hole fuses.
- Reliability: Provide robust protection for critical circuits in demanding environments.
BonChip Electronics is a distributor of Littelfuse products, including the 871 series fuses.
6. Broadcom Launches 200G/Lane DSP for Gen-AI
Broadcom has recently targeted next-generation AI applications with its new Sian2 DSP solution infrastructure for 200-G-per-lane optical interfaces. The Sian2 DSP, or BCM85828, offers full support for 800 G and 1.6-T optical transceivers, doubling the bandwidth of existing solutions while maintaining lower power consumption and latency. Broadcom notes that these improvements are essential for scaling up AI clusters, which require increasingly high-performance and reliable network connectivity.
Application diagram using the BCM85828 transceiver PHY. Image used courtesy of Broadcom
Manufactured using a 5-nm process, the Sian2 DSP consumes less than 28
W, making it one of the most power-efficient solutions for 1.6-T
transceivers. It features sub-80-ns roundtrip latency (ingress and
egress) and supports data rates of 212.5 Gbps and 226.875 Gbps,
providing flexibility for both InfiniBand and Ethernet-based
applications. Additionally, the solution integrates a low-swing and
high-swing laser driver for both SiP- and EML-based optical modules. It
also supports multiple forward error correction (FEC) schemes, including
bypass, segmented, and concatenated FEC, enhancing data integrity
during transmission.
By staying informed about the latest industry trends and technologies, you can make informed decisions and stay ahead of the competition. BonChip Electronics is your trusted partner for all your electronic component needs.
