New flowDUAL E3 SiC - Greater scalability for your high-power application
More than just a Half-Bridge
Engineered for maximum power density, this half-bridge module can serve to construct excellent H-bridges and sixpacks. Far higher current handling, enhanced power loss dissipation, greater scalability than a solution with a single-module footprint – the flowDUAL delivers all this and more.
In combination with VINcoPress and advanced die-attach technology,
this new baseplate-less module is your first choice for a wide range of
high-power use cases where utmost efficiency and reliability are top
priorities.
Find out more technical details and ordering information on our product pages.
Main benefits
- Outstanding, ≥99% conversion efficiency brings down overall costs
- Low stray inductance and symmetrical chip layout enable higher switching frequency and lower system costs
- Greater supply chain security with
– the new flow E3 industry standard-compatible housing (CTI >600)
– the latest multi-sourced SiC devices - Excellent thermal performance with VINcoPress technology to decrease junction temperature and increase lifetime
- Pre-applied PC-TIM rated for 150°C helps reduce production cost
Applications
- Industrial drives
- Embedded drives
- EV Chargers
- Solar
- UPS
As an distributor of Vincotech, BONCHIP offers an extensive ordering and service platform for Vincotech products to our valued customers. We are dedicated to delivering genuine, top-of-the-line Vincotech items at the most competitive prices with efficient delivery, making Vincotech the preferred choice in the power module market.
When in search of Vincotech products, look no further than BONCHIP—your go-to partner that assures original equipment manufacturer quality, the most advantageous pricing, and prompt delivery. Opting for BONCHIP means selecting a combination of reliability, expertise, and value.
