Alpha and Omega Semiconductor Unveils 100V MOSFET for Power Supplies Applications
Alpha and Omega Semiconductor Limited (AOS), renowned for designing, developing, and supplying a diverse array of discrete power devices, wide band gap power devices, power management integrated circuits (ICs), and modules worldwide, has introduced the AONA66916, a 100V MOSFET. This device comes in the company's novel DFN 5 x 6 package, which features innovative cooling from both the top and bottom sides. With a longstanding reputation for reliable power semiconductors essential for high-performance applications, AOS continues to serve designers' needs. The AONA66916 showcases the latest in packaging technology, which significantly mitigates overheating, facilitating the creation of more efficient designs in sectors like telecommunications and heavy industry, where equipment often contends with extreme operating environments.
Ordinarily, heat dissipation in a standard DFN 5 x 6 package primarily occurs through the lower contact, which passes most of the thermal load to the circuit board (PCB), adding complexity to thermal management design to satisfy system demands. However, the novel top and bottom cooling design of AOS' DFN 5 x 6 package dramatically enhances heat transfer efficiency via the enlarged surface area of the top exposed contact to the heat sink. This design innovation leads to a remarkably low thermal resistance (Rthc-top max) of 0.5°C/W and an improved thermal performance that benefits the PCB. The footprint of the AONA66916 matches the usual DFN 5 x 6 package size, allowing for seamless integration into existing PCB designs without modifications.
Leveraging AOS' 100V AlphaSGT technology, the AONA66916 offers an excellent figure of merit (FOM) that ensures balanced performance in hard-switching scenarios. With its maximum RDS(on) value at a mere 3.4 milli-ohms and a junction temperature rating up to 175°C, the AONA66916 stands as a testament to efficiency and endurance.
"Managing heat in high power designs is often a considerable challenge, which AOS has adeptly navigated with our state-of-the-art top exposed package," remarked Peter H. Wilson, Marketing Sr. Director of MOSFET at AOS. "The novel design doesn't just provide superior thermal transference through its largely exposed surface area, but it also results in a cooler running device, paving the way for systems that are more efficient and durable."
inal design,” said Peter H. Wilson, Marketing Sr. Director of the MOSFET product line at AOS.
